Die-attach films, are cured silicone films, offering excellent uniformity for precise thickness and eliminating fillets and bleed-out that commonly occur with epoxy adhesives. Die-attach applications target for typical semiconductor package, especially for MEMS sensors.

Silicone hybrid adhesives combine silicone and organics in a unique formulation, delivering enhanced mechanical properties that silicone alone can’t achieve, such as higher modulus and strong adhesion to various surfaces. They also feature excellent optical properties and non-yellowing for light post to reliability for light module applications.

Silicone hot melt, offered in film, cartridge and tablet formats, provide excellent adhesion to a variety of substrates, as well as stress relief for warpage mitigation. Excellent for semiconductor processing as mold-underfill, soft mold and encapsulation.